bss8402dw document number: ds30380 rev. 21 - 2 1 of 7 www.diodes.com february 2014 ? diodes incorporated bss8402dw complementary pair enh ancement mode mosfet product summary device v (br)dss r ds(on) max i d t a = +25c q1 60v 13.5 ? @ v gs = 10v 115ma q2 -50v 10 ? @ v gs = -5v -130ma description this mosfet has been designed to minimize the on-state resistance (r ds(on) ) and yet maintain superior switching performance, making it ideal for high efficiency po wer management applications. applications ? general purpose interfacing switch ? power management functions ? analog switch features and benefits ? low on-resistance ? low gate threshold voltage ? low input capacitance ? fast switching speed ? low input/output leakage ? complementary pair ? totally lead-free & fully rohs compliant (notes 1 & 2) ? halogen and antimony free. ?green? device (note 3) ? ? qualified to aec-q101 standards for high reliability mechanical data ? case: sot363 ? case material: molded plastic. ?green? molding compound. ul flammability classification rating 94v-0 ? moisture sensitivity: level 1 per j-std-020 ? terminals: matte tin finish annealed over alloy 42 leadframe (lead free plating). solderable per mil-std-202, method 208 ? terminal connections: see diagram ? weight: 0.006 grams (approximate) ordering information (note 4) part number compliance case packaging bss8402dw-7-f standard sot363 3,000/tape & reel BSS8402DW-13-F standard sot363 10,000/tape & reel bss8402dwq-7 automotive sot363 3,000/tape & reel bss8402dwq-13 automotive sot363 10,000/tape & reel notes: 1. no purposely added lead. fully eu directiv e 2002/95/ec (rohs) & 2011/6 5/eu (rohs 2) compliant. 2. see http://www.diodes.com/quality/lead_free.html for more in formation about diodes incorporated?s definitions of halogen- a nd antimony-free, "green" and lead-free. 3. halogen- and antimony-free "green? products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total br + cl) and <1000ppm antimony compounds. 4. for packaging details, go to our websit e at http://www.diodes.com /products/packages.html marking information date code key year 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 code p r s t u v w x y z a b c d month jan feb mar apr may jun jul aug sep oct nov dec code 1 2 3 4 5 6 7 8 9 o n d sot363 top view top view internal schematic s 2 d 2 q 1 q 2 d 1 s 1 g 2 g 1 knp ym e3 knp ym knp = product type marking code ym = date code marking for sat (shanghai assembly/ test site) ym = date code marking for cat (chengdu assembly/ test site) y or y = year (ex: a = 2013) m = month (ex: 9 = september)
bss8402dw document number: ds30380 rev. 21 - 2 2 of 7 www.diodes.com february 2014 ? diodes incorporated bss8402dw maximum ratings ? total device (@t a = +25c, unless otherwise specified.) characteristic symbol value units power dissipation (note 5) p d 200 mw thermal resistance, junction to ambient r ja 625 c/w operating and storage temperature range t j, t stg -55 to +150 c maximum ratings n-channel ? q 1 , 2n7002 section (@t a = +25c, unless otherwise specified.) characteristic symbol value units drain-source voltage v dss 60 v drain-gate voltage r gs 1.0m ? v dgr 60 v gate-source voltage continuous pulsed v gss 20 40 v drain current (note 5) continuous continuous @ +100c pulsed i d 115 73 800 ma maximum ratings p-channel ? q 2 , bss84 section (@t a = +25c, unless otherwise specified.) characteristic symbol value units drain-source voltage v dss -50 v drain-gate voltage r gs 20k ? v dgr -50 v gate-source voltage continuous v gss 20 v drain current (note 5) continuous i d -130 ma note: 5. device mounted on fr-4 pcb, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on diodes inc. suggested pad layout d ocument ap02001, which can be found on our website at http://www.diodes.com.
bss8402dw document number: ds30380 rev. 21 - 2 3 of 7 www.diodes.com february 2014 ? diodes incorporated bss8402dw electrical character istics n-channel ? q 1 , 2n7002 section (@t a = +25c, unless otherwise specified.) characteristic symbol min typ max unit test condition off characteristics (note 6) drain-source breakdown voltage bv dss 60 70 ? v v gs = 0v, i d = 10a zero gate voltage drain current @ t c = +25c @ t c = +125c i dss ? ? 1.0 500 a v ds = 60v, v gs = 0v gate-body leakage i gss ? ? 10 na v gs = 20v, v ds = 0v on characteristics (note 6) gate threshold voltage v gs(th) 1.0 ? 2.5 v v ds = v gs , i d = 250a static drain-source on-resistance @ t j = +25c @ t j = +125c r ds(on) ? 3.2 4.4 7.5 13.5 ? v gs = 5.0v, i d = 0.05a v gs = 10v, i d = 0.5a on-state drain current i d(on) 0.5 1.0 ? a v gs = 10v, v ds = 7.5v forward transconductance g fs 80 ? ? ms v ds =10v, i d = 0.2a dynamic characteristics input capacitance c iss ? 22 50 pf v ds = 25v, v gs = 0v, f = 1.0mhz output capacitance c oss ? 11 25 pf reverse transfer capacitance c rss ? 2.0 5.0 pf switching characteristics turn-on delay time t d(on) ? 7.0 20 ns v dd = 30v, i d = 0.2a, r l = 150 ? , v gen = 10v, r gen = 25 ? turn-off delay time t d(off) ? 11 20 ns electrical character istics p-channel ? q 2 , bss84 section (@t a = +25c, unless otherwise specified.) characteristic symbol min typ max unit test condition off characteristics (note 6) drain-source breakdown voltage bv dss -50 ? ? v v gs = 0v, i d = -250a zero gate voltage drain current i dss ? ? ? ? ? ? -1 -2 -100 a a na v ds = -50v, v gs = 0v, t j = 25c v ds = -50v, v gs = 0v, t j = 125c v ds = -25v, v gs = 0v, t j = 25c gate-body leakage i gss ? ? 10 na v gs = 20v, v ds = 0v on characteristics (note 6) gate threshold voltage v gs(th) -0.8 ? -2.0 v v ds = v gs , i d = -1ma static drain-source on-resistance r ds (on) ? ? 10 ? v gs = -5v, i d = -0.100a forward transconductance g fs .05 ? ? s v ds = -25v, i d = -0.1a dynamic characteristics input capacitance c iss ? ? 45 pf v ds = -25v, v gs = 0v, f = 1.0mhz output capacitance c oss ? ? 25 pf reverse transfer capacitance c rss ? ? 12 pf switching characteristics turn-on delay time t d(on) ? 10 ? ns v dd = -30v, i d = -0.27a, r gen = 50 ? , v gs = -10v turn-off delay time t d(off) ? 18 ? ns note: 6. short duration pulse test used to minimize self-heating effect.
bss8402dw document number: ds30380 rev. 21 - 2 4 of 7 www.diodes.com february 2014 ? diodes incorporated bss8402dw n-channel ? 2n7002 section 0 0.2 0.4 0.6 0.8 1.0 01 2345 v , drain-source voltage (v) figure 1 on-region characteristics ds i , drain-source current (a) d 0 1 2 3 4 5 00.2 i , drain current (a) figure 2 on-resistance vs. drain current d t = 25 c j 6 7 0.4 0.6 0.8 1.0 r , static drain-source on-resistance ( ) ds(on) 1.0 1.5 2.0 2.5 3.0 -55 -30 -5 20 45 70 95 120 145 t , junction temperature ( c) figure 3 on-resistance vs. junction temperature j v = 10v, i gs d = 200ma r , static drain-source on-resistance ( ) ds(on) 0 v , gate to source voltage (v) figure 4 on-resistance vs. gate-source voltage gs 1 2 3 4 5 6 0 2 4 6 8 1012141618 r , static drain-source on-resistance ( ) ds(on) 0 2 1 4 3 00.20.4 0.6 0.8 1 v g a t e-s o u r c e c u r r en t (v) gs, i , drain current (a) figure 5 typical transfer characteristics d 6 5 8 7 10 9 v = 10v ds 0 50 100 150 200 250 025 50 75 100 125 150 175 200 p , p o we r dissi p a t i o n (mw) d t , ambient temperature ( c) figure 6 max power dissipation vs. ambient temperature a
bss8402dw document number: ds30380 rev. 21 - 2 5 of 7 www.diodes.com february 2014 ? diodes incorporated bss8402dw p-channel ? bss84 section v , drain-source voltage (v) ds figure 7 typical drain-source leakage current vs. voltage i, d r ai n leaka g e c u r r e n t (na) dss 1000 5 1015202530354045505560 t = 25c a t = 85c a t = 125c a t = 150c a 100 10 1 v , gate threshold voltage (v) gs(th) 0.8 1 1.2 1.4 1.6 1.8 2 -50 -25 0 25 50 75 100 125 150 t , junction temperature (c) figure 8 gate threshold variation vs. ambient temperaure j 0 -600 -500 -400 -300 -200 -100 0-2 -1 -5 -4 -3 i, d r ain-s o u r c e c u r r en t (ma) d v , drain-source (v) ds figure 9 drain-source current vs. drain-source voltage t = 25c a -0.0 -1.0 -0.8 -0.6 -0.4 -0.2 0-2-3-4 -1 -8 -7 -6 -5 i, d r ai n c u r r e n t (a) d v , gate-to-source voltage (v) gs figure 10 drain current vs. gate-source voltage 0 1 2 4 5 3 6 8 7 10 9 0-1-2 -3 -4 -5 v , gate to source (v) figure 11 on-resistance vs. gate-source voltage gs t= 25c a t = 125c a r , static drain-source on-resistance ( ) ds(on) 0 3 6 9 12 15 -50 -25 0 25 50 125 100 75 150 t , junction temperature (c) figure 12 on-resistance vs. junction temperature j v = -10v i = -0.13a gs d r , on-resistance ( ) ds
bss8402dw document number: ds30380 rev. 21 - 2 6 of 7 www.diodes.com february 2014 ? diodes incorporated bss8402dw package outline dimensions please see ap02002 at http://www.diodes.com /datasheets/ap02002.pdf for latest version. 0.0 5.0 10.0 -0.0 -0.2 -0.4 -0.6 -0.8 1.0 i , drain current (a) figure 13 on-resistance vs. drain current d 15.0 20.0 25.0 v = -8v gs v = -10v gs v = -3v gs v = -3.5v gs v = -4v gs v = -6v gs v = -5v gs r , o n - r esis t a n c e ( ) ds -v , drain-source voltage (v) ds figure 14 typical drain-source leakage current vs. voltage -i , d r ain leaka g e c u r r en t (na) dss 1000 5 101520253035404550 t = 25c a t = 85c a t = 125c a t = 150c a 100 10 1 -v , gate threshold voltage (v) gs(th) t , junction temperature (c) figure 15 gate threshold variation vs. ambient temperaure j 0.8 1 1.2 1.4 1.6 1.8 2 -50 -25 0 25 50 75 100 125 150 sot363 dim min max typ a 0.10 0.30 0.25 b 1.15 1.35 1.30 c 2.00 2.20 2.10 d 0.65 typ f 0.40 0.45 0.425 h 1.80 2.20 2.15 j 0 0.10 0.05 k 0.90 1.00 1.00 l 0.25 0.40 0.30 m 0.10 0.22 0.11 0 8 - all dimensions in mm a m j l d b c h k f
bss8402dw document number: ds30380 rev. 21 - 2 7 of 7 www.diodes.com february 2014 ? diodes incorporated bss8402dw suggested pad layout please see ap02001 at http://www.diodes.com/ datasheets/ap02001.pdf for the latest version. important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product descri bed herein. diodes incorporated does not assume any liability ari sing out of the application or use of this document or any product described herein; neither does diodes incorporated convey any license under its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whose products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability w hatsoever in respect of any products purchased through unauthoriz ed sales channel. should customers purchase or use diodes inco rporated products for any unintended or una uthorized application, customers shall i ndemnify and hold diodes incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death a ssociated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product names and markings noted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of t his document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical com ponents in life support devices or systems without the express written approval of the chief executive offi cer of diodes incorporated. as used herein: a. life support devices or syst ems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support devic e or system whose failure to perform can be reasonably expect ed to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-rel ated requirements concerning the ir products and any use of diodes incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorporate d and its representatives against any damages arisi ng out of the use of diodes incorporated pr oducts in such safety-critical, life suppor t devices or systems. copyright ? 2014, diodes incorporated www.diodes.com dimensions value (in mm) z 2.5 g 1.3 x 0.42 y 0.6 c1 1.9 c2 0.65 x z y c1 c2 c2 g
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